EMK21H2J-36.864M
REGULATORY COMPLIANCE
2011/65 +
2015/863
(Data Sheet downloaded on Aug 28, 2020)
191 SVHC
ITEM DESCRIPTION
MEMS Clock Oscillators LVCMOS (CMOS) 1.8Vdc 4 Pad 3.2mm x 5.0mm Plastic Surface Mount (SMD) 36.864MHz ±50ppm over
-40°C to +85°C
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
36.864MHz
±50ppm Maximum over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability
over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,
260°C Reflow, Shock, and Vibration)
±1ppm Maximum First Year
1.8Vdc ±5%
18mA Maximum
90% of Vdd Minimum (IOH=-8mA)
10% of Vdd Maximum (IOL=+8mA)
2nSec Maximum (Measured from 20% to 80% of waveform)
50 ±5(%) (Measured at 50% of waveform)
15pF Maximum
CMOS
Power Down (Disabled Output: Logic Low)
+0.7Vdd Minimum or No Connect to Enable Output, +0.3Vdd Maximum to Disable Output
50µA Maximum (Disabled Output: Logic Low)
250pSec Maximum, 100pSec Typical
50mSec Maximum
-55°C to +125°C
Aging at 25°C
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Output Control Function
Output Control Input Voltage
Standby Current
Peak to Peak Jitter (tPK)
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Flammability
Mechanical Shock
Moisture Resistance
Moisture Sensitivity Level
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Thermal Shock
Vibration
MIL-STD-883, Method 3015, Class 2, HBM 2000V
UL94-V0
MIL-STD-883, Method 2002, Condition G, 30,000G
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003 (Pads on bottom of package only)
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A, 20G
www.ecliptek.com | Specification Subject to Change Without Notice | Revision K 09/10/2014 | Page 1 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EMK21H2J-36.864M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
3.20
±0.15
0.85
±0.15
0.08
MAX
2
5.00
±0.15
2.39
±0.10
1
C0.35
±0.10
0.80
±0.15
4
PIN
1
CONNECTION
Power Down
Ground
Output
Supply Voltage
1.20 ±0.10 (x4)
2
3
3
R0.58
±0.10
1.15
±0.10
(x4)
4
LINE MARKING
1
XXXX or XXXXX
XXXX or XXXXX=Ecliptek
Manufacturing Lot Code
Suggested Solder Pad Layout
All Dimensions in Millimeters
0.5º
1.60 (X4)
MAX
1.50 (X4)
1.04
Solder Land
(X4)
0.60
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision K 09/10/2014 | Page 2 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EMK21H2J-36.864M
OUTPUT WAVEFORM & TIMING DIAGRAM
POWER DOWN INPUT
V
IH
V
IL
CLOCK OUTPUT
V
OH
80% of Waveform
50% of Waveform
20% of Waveform
V
OL
t
PLZ
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
t
PZL
OUTPUT DISABLE
(LOGIC LOW)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision K 09/10/2014 | Page 3 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EMK21H2J-36.864M
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.01µF
(Note 1)
0.1µF
(Note 1)
Ground
C
L
(Note 3)
Tri-State or
Power Down
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass
capacitor close (less than 2mm) to the package ground and supply voltage pin is required.
Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and
High bandwidth (>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet
for ‘Load Drive Capability’.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision K 09/10/2014 | Page 4 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EMK21H2J-36.864M
Recommended Solder Reflow Methods
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 Seconds
6°C/Second Maximum
8 Minutes Maximum
Level 1
Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision K 09/10/2014 | Page 5 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
